Voiding is the cause of multiple failure mechanisms. Mike Konrad speaks with solder material expert Tim O'Neill of Aim Solder, stencil manufacturer Prakash Gango of StenTech, and cleaning materials manufacturer Kalyan Nukala of Zestron about how solder voiding leads to product failures and methods to reduce voiding.

 

The guests may be reached here:

Tim O'Neill

AIM Solder

<a href='mailto:toneill@aimsolder.com'>toneill@aimsolder.com</a>

<a href='http://www.aimsolder.com'>www.aimsolder.com</a>

 

Prakash Gango

StenTech

<a href='mailto:prakash@stentech.com'>prakash@stentech.com</a>

<a href='http://www.stentech.com'>www.stentech.com</a>

 

Kalyan Nukala

<a href='mailto:Kalyan.Nukala@zestronusa.com'>Kalyan.Nukala@zestronusa.com</a>

<a href='http://www.zestron.com'>www.zestron.com</a>

PCB Chat 69: Manny Marcano on Changes in the Mainstream PCB CAD Market

Recorded conversations and interviews on electronics design and manufacturing with the editors of PCD&F/Circuits Assembly